Scanning Electron Microscopy Fractography Analysis of Fractured Hollow Implants
Fracture of the implant is one of the possible complications affecting dental implants; it is a rare event but of great clinical relevance. The aim of the present study was to perform a scanning electron microscopy (SEM) fractography evaluation of 7 International Team for oral Implantology (ITI) hollow implants removed because of fracture. The most common clinical risk factors, such as malocclusion, bruxism, and cantilevers on the prosthesis, were absent. Seven fractured ITI hollow implants were retrieved from 5 patients and were analyzed with the use of SEM. SEM analysis showed typical signs of a cleavage-type fracture. Fractures could be due to an association of multiple factors such as fatigue, inner defects, material electrochemical problems, and tensocorrosion.Abstract

Figure 1. The fracture appears multifaceted and intragranular, and typical markings of cleavage such as river pattern lines are largely represented along the fracture plane (arrows) (SEM ×282). Figure 2. Mathematical reconstruction of the previous image. The direction, the depth, and the degree of convergence of the crack lines can be appreciated (arrows). Figure 3. Intragranular microcrack of 6 microns that runs at about 50° with respect to the holes of the implant (arrow) (SEM ×1110). Figure 4. Intragranular microcrack of 28 × 6 microns that runs at about 60° with respect to the fracture surface (this phenomenon is usual in fatigue fracture mechanisms; arrow) (SEM ×1030).

Figure 5. Tip of short fatigue microcrack. The base of the microcrack shows transversal lines caused by the release of energy at the crack tip produced by mechanisms of plasticity-induced crack closure (arrows). At this level, the corrosion phenomenon is enhanced by the presence of both biological fluid and local metal strain (tensocorrosion) (SEM ×1120). Figure 6. Mathematical reconstruction of the previous image. The plastic deformation is more evident and is represented by transversal lines between the walls of the crack. Figure 7. The different pseudocolored areas show different grains, and the lines (arrows) on the grain surfaces represent crystallographic planes with the highest packing density (SEM ×3050). Figure 8. The fracture runs through the grains and tends to change direction at the grain boundary (arrows) (SEM ×1110). Figure 9. The transgranular fracture runs parallel to the fracture surface (arrows). The pseudocolored area was reconstructed mathematically (SEM ×73). Figure 10. Mathematical reconstruction of the previous image. The same crack lines that are stopped by grain boundaries are visible (arrows).
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